| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_27652c88758a741ef03fbc9f6852746b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65147f09c27bafad8eaa268c044a25ff |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate |
2008-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9536308103a5e42b40945658e987e48b |
| publicationDate |
2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008123210-A1 |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
This invention provides a photosensitive resin composition which is suitable as a buffer coat material and a rewiring layer in an LSI chip and can be cured in air by photopolymerization. The photosensitive resin composition comprises a photosensitive silicone containing a styryl group as a photosensitive group and a photopolymerization initiator having a specific structure. There are also provided a method for cured relief pattern formation using the photosensitive resin composition, and a semiconductor device comprising the cured relief pattern. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5525821-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009078336-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8475996-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017095643-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012088575-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9434818-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010031272-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047746-A |
| priorityDate |
2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |