A photosensitive adhesive composition contains (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radioactive polymerizable compound and (D) a photosensitive adhesive compound containing a photo initiator. The photo initiator (D) contains a photo initiator which has a function of promoting reaction of polymerization and/or curing of the epoxy resin by at least irradiation of a radioactive ray (D1).