| abstract |
Disclosed is a positive photosensitive resin composition which is excellent in chemical resistance after heat treatment and enables to form a pattern having a small taper angle. Specifically disclosed is a positive photosensitive resin composition containing (a) a polyamide acid and/or a polyamide acid ester having a structural unit represented by the general formula (1) below, (b) a quinonediazide compound and (c) a polyfunctional acrylate compound. (In the formula (1), R1 represents a tri- to octa-valent organic group having 2 or more carbon atoms; R2 represents a di- to octa-valent organic group having 2 or more carbon atoms; R3 and R4 may be the same or different and represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms; p and q represent an integer of 0-4; r represents 1 or 2; and s represents an integer of 0-2. In this connection, p and q satisfy p + q > 0.) |