| abstract |
[PROBLEMS] To provide a lead frame having improved mechanical strength of an inner lead, a method for manufacturing such lead frame and a semiconductor device having such lead frame mounted thereon. [MEANS FOR SOLVING PROBLEMS] A lead frame is provided with a frame; a die pad support bar extending toward the center from the frame; a die pad fixed to the center of the frame by the die pad support bar; and a plurality of inner leads whose leading end side extends toward the center of the frame from the frame. A rigidity reinforcing section is arranged on the leading end portion of the inner lead. The rigidity reinforcing section is fixed with a resin, at a portion where an interval between the adjacent inner leads is 170μm or less, and the leading end periphery on the frame center side is arranged at a position 1.2mm or less from the leading end periphery of the inner lead, and a resin liquid applied on the rear surface side of the wire bonding surface of the inner lead is firmly fixed in a gap between the adjacent inner leads. |