| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3de011340895b8559b31a2bebdded478
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c24be1f7177a6191e531316bb711610e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec5b8c0fc1f827c1360a8f5ea5652225 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-0689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502715 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2007-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_763f5ebac9d3f8e09567ba317413031c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_586d3e87f5a66c87b40947c47dd5dd35 |
| publicationDate |
2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008074291-A1 |
| titleOfInvention |
Method for the production of vias and conductor tracks |
| abstract |
The invention relates to a method for the production of vias and conductor tracks connected thereto by means of galvanic deposition of a metal. Said method comprises the following steps: - regions of the conductor tracks of a substrate material and the regions of the openings of the holes for the vias are coated with a seed layer suitable for the metal to be deposited; - an electrical contact is provided from the seed layer on a first side of the substrate material to an electrolysis bath; - metal is galvanically deposited on the seed layer on the first side of the substrate material; - the deposition of the metal is continued until said metal reaches the seed layer, in the holes, that is arranged on the second side opposite to the first side and makes electrical contact with said layer; - the sealing of the holes for the production of the vias and the conductor tracks on the second side of the substrate material is accomplished at the same time by deposition of the metal. |
| priorityDate |
2006-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |