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publicationDate 2008-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2008073485-A3
titleOfInvention Plastic electronic component package
abstract A plastic package for an image sensor comprises a plastic body molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. An interfacial layer is formed on the surfaces of the leadframe composing of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The curic oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
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