| abstract |
Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided. |