Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fc216fbe96f4c98ae94f3d760299fca6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ce1442cb100ebd2997f7edb90f27ed8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-012 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
filingDate |
2007-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00daca4ae5887216171b1ce48000c78a |
publicationDate |
2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2008067198-A2 |
titleOfInvention |
Low temperature curable conductive adhesive and capacitors formed thereby |
abstract |
An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: 60-95 wt% conductor; 5-40 wt% resin; wherein the resin has: 55-98.9 wt% monomer defined by Structure A; 0.1-15 wt% catalyst; 1-30 wt% accelerant defined by Structure B; and 0-15 wt% filler. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9780236-B2 |
priorityDate |
2006-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |