| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f14a16ef20d5cab7845547baafc6978
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae451307a3c0ea8161a93a727cf68a4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_571c221a63b28ae7db77d50217064c55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecbab73d031f3279df7e95256cd607a2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06589
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-90 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5387 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate |
2007-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acb0be631b2ee9d11fbbb076488a26ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_126e7af509c790b213ccb23bb43126ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_013be535393e8768ec5a67afe6b15089 |
| publicationDate |
2008-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008051853-A2 |
| titleOfInvention |
High density ic module |
| abstract |
A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die (8) to a substrate (4) opposite a first die (6) bonded to the substrate (4). The second die (8) is bonded using heat conducted through the first die (6) to the substrate (4), and optionally through an underfill material. The first (6) and second (8) die are connected such that bumps (10) are connected to common bonding pads (12) on the substrate (4). Bumps (10) on one of the die extend through openings in the substrate (4) to connect to the common bonding pads (12). The bonding pads (12) are within the perimeter of the first die (6). |
| priorityDate |
2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |