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filingDate 2007-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2008050300-A1
titleOfInvention Electronic device having a plastic substrate
abstract A method of manufacturing a thin- film electronic device comprises applying a plastic coating to a rigid carrier substrate (12) using a wet casting process, the plastic coating forming a plastic substrate (22). The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane. The anisotropy of the thermal expansion in the plastic substrate of the invention enables the expansion of the substrate during the thermal lift-off process to be in the perpendicular direction. This has been found to aid the lift-off process and also protect the components mounted on the upper surface of the plastic substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010064185-A2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011227086-A1
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