| abstract |
The invention relates to heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer of formula (I). Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterised by excellent mechanical properties, high glass transition temperatures and high impact resistance. |