| abstract |
A liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by containing (A) epoxy resin including a liquid epoxy resin, (B) hardening agent including a liquid aromatic amine, (C) hydrazide compound of less than 2 μm average particle diameter and (D) inorganic filler of less than 2 μm average particle diameter. |