| abstract |
Disclosed is a resin paste for die bonding, which contains a polyurethane imide resin represented by the general formula (I) below, a thermosetting resin, a filler and a solvent for printing. [chemical formula 1] (I) (In the formula, R1 represents a divalent organic group containing an aromatic ring or an aliphatic ring; R2 represents a divalent organic group having a molecular weight of 100-10,000; R3 represents a tetravalent organic group containing 4 or more carbon atoms; and n and m independently represent an integer of 1-100.) |