| abstract |
Compositions useful in microelectronic device manufacturing for cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that include copper metallization, for example, in operations such as post-chemical mechanical polishing cleaning of microelectronic device wafers. The aqueous compositions include at least one alkanolamine, at least one quaternary ammonium hydroxide, uric acid, at least one alcohol and at least one additional organic acid antioxidant. |