http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008031366-A1

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filingDate 2006-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffe0e7602ce62689ac5c5de85838a9f5
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publicationDate 2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2008031366-A1
titleOfInvention Printed circuit board, particularly ceramic circuit board
abstract The invention relates to a printed circuit board, particularly a ceramic circuit board, having a first layer (1), wherein the first layer is a metal layer, and is provided with a connector for the electric conducting connection via laser welding (4). It is a known fact that with laser welding the accurate control of the laser parameters within the allowed tolerances is very difficult. A particular problem is a laser welding having an energy that is too high due to standard deviation. A printed circuit board is provided, having a second layer (9, 11, 12, 20), having at least one protective function in order to prevent the detrimental effects of laser welding (4; 14 to 19), since the second layer is provided at least with the connection by means of laser welding for the connection in a material fit. Further, advantages are created in connection/step-over combinations, or connections having an insulation layer (6).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10098240-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106031313-B
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priorityDate 2006-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 31.