| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f37fefc346625e2537aa1f7ac0484b51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate |
2007-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e6d267486363e3aca7601933c0cd21d |
| publicationDate |
2008-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008023465-A1 |
| titleOfInvention |
Microelectronic machine mechanism device, and its manufacturing method |
| abstract |
Provided is a microelectronic machine mechanism device having a simple constitution but capable of reducing the strain of a semiconductor substrate. Both the semiconductor substrate (17) and a second substrate (14) are disposed to confront one principal face (13a) of a first substrate (13) and are connected with the principal face (13a) of the first substrate (13). As a result, the first substrate (13) can have its constitution simplified without needing an internal wiring and a side wiring, and can shorten its wiring length to lower the resistance thereby to acquire excellent electric characteristics with a low power consumption. It is also possible to suppress the strain of the semiconductor substrate (17). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017049237-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9056766-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8810027-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10432168-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018200301-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012074554-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010004766-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5769964-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021016923-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014357007-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10859814-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7037967-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7222838-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009150087-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009150087-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013043252-A |
| priorityDate |
2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |