| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cc1d33d941cfc844284e628dcd4479fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d34a345d1cfe9948425b594bf563c496
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_863cb4cda159fbdd6747fde4e81d0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fe78ff15beca93918be5ac1eb57c3091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d49ce549fb531dd4e2369fce6c38e568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95fb0ba8bd9b9ee1c8de4b1e633ea6ed |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4757 |
| filingDate |
2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14c51b6cc45868b294469f0f5bb4959c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a84aab1f9963247cea72bc48264d5c56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b8f0c6c44c39d40c560d9ef1e1f662
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5ce47bd9687df783dafcf31a79b39d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b364718d507d3ef76469ed1386b3f050
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e6a03d07e6226ddf1ec2f85936d0d1f |
| publicationDate |
2008-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008022277-A2 |
| titleOfInvention |
Selective chemistry for fixed abrasive cmp |
| abstract |
Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2186121-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2186121-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8092707-B2 |
| priorityDate |
2006-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |