http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007145679-A2

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filingDate 2007-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_123a85d4c83451c79d9e833727ba11e2
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publicationDate 2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2007145679-A2
titleOfInvention Planarization of gan by photoresist technique using an inductively coupled plasma
abstract Films of Ill-nitride for semiconductor device growt are planarized using an etch-back method. The metho includes coating a III-nitride surface having surface roughness features in the micron range with a sacrificial planarization material such as an appropriately chose photoresist. The sacrificial planarization material is then etched together with the Ill-nitride roughness features using dry etch methods such as inductivel coupled plasma reactive ion etching. By closely matchin the etch rates of the sacrificial planarization materia and the III-nitride material, a planarized Ill-nitride surface is achieved. The etch-back process together wit a high temperature annealing process yields a planarize III -nitride surface with surface roughness features reduced to the nm range. Planarized Ill-nitride, e.g., GaN, substrates and devices containing them are als provided.
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Total number of triples: 29.