| abstract |
The invention provides a resin composition for stereolithography which exhibits low absorption of water and moisture even after the lapse of time in an uncured state and keeps a low rate of moisture absorption even at high humidity and which has high cure sensitivity and makes it possible to produce three -dimensional articles excellent in dimensional accuracy, mechanical characteristics, dimensional stability, and other characteristics in a shortened irradiation time. A resin composition for stereolithography which contains an oxetane represented by the general formula (I): (I) (wherein R1 is alkyl of 1 to 5 carbon atoms; and R2 is alkylene of 2 to 10 carbon atoms which may contain an ether linkage) in an amount of 3 to 60% by mass based on the whole mass of the composition. |