Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64ca8009b5daf093db15075fe6d5df8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be62558447df97eceec9aaf3d84fb235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9846be686414612dad2e6a4a7123860 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_02d923fcf4f822c641d5200f4f43cebf http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7edf5889c86ba999c55da80488fa7cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dd931ca45457a3f9480bb4170b7102f7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-6656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66628 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66636 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-26513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7848 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02576 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02529 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02579 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02378 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66287 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00 |
filingDate |
2007-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a2391c42cc579bd0f94b7aa413b26fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_213e6855ce19e6d63c5a0559f9fba1a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfbdd87f1ef8749d5948f44beaf5ac79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af92082cdab913e2c9baa87902606e19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35f9f2891494a70a84f5887729446858 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dae60a04c38be9f2b889dd48b3ad75c |
publicationDate |
2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2007130916-A2 |
titleOfInvention |
A method of ultra-shallow junction formation using si film alloyed with carbon |
abstract |
A method for forming an ultra shallow junction on a substrate is provided. In certain embodiments a method of forming an ultra shallow junction on a substrate is provided. The substrate is placed into a process chamber. A silicon carbon layer is deposited on the substrate. The silicon carbon layer is exposed to a dopant. The substrate is heated to a temperature greater than 950°C so as to cause substantial annealing of the dopant within the silicon carbon layer. In certain embodiments the substrate is heated to a temperature between about 1000°C and about 1100°. In certain embodiments the substrate is heated to a temperature between about 1030°C and 1050°C. In certain embodiments, a structure having an abrupt p-n junction is provided. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112376031-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112376031-A |
priorityDate |
2006-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |