| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f909d1ce254878e22e2b67c55eea78d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8f82d178dab0bab41e95ced580e83e7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_272b01cbd8da2650ab23a6e8ddc3ca00 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-485 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate |
2006-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b623f20a6422479d51f544434086b722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f86b094097654b1c9f62510f0e8c3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b0a4968f47c0955298a2eca208aac85 |
| publicationDate |
2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007130063-A1 |
| titleOfInvention |
Electronic molding composition and method |
| abstract |
A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices. |
| priorityDate |
2006-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |