http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007118121-A2

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filingDate 2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8c9f5cc84ceb66a41152ee5c789f585
publicationDate 2007-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2007118121-A2
titleOfInvention Method and structure for fabricating solar cells using a layer transfer process
abstract A reusable silicon substrate device for use with layer transfer process. The device has a reusable substrate having a surface region, a cleave region, and a total thickness of material. The total thickness of material is at least N times greater than a first thickness of material to be removed. In a specific embodiment, the first thickness of material to be removed is between the surface region and the cleave region, whereupon N is an integer greater than about ten. The device also has a chuck member adapted to hold a handle substrate member in place. The chuck member is configured to hold the handle substrate in a manner to facilitate bonding the handle substrate to the first thickness of material to be removed. In a preferred embodiment, the device has a mechanical pressure device operably coupled to the chuck member. The mechanical pressure device is adapted to provide a force to cause bonding of the handle substrate to the first thickness of material to be removed.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7951696-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2159025-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324089-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7820532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2088632-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8053867-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8975170-B2
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priorityDate 2006-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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