| abstract |
Provided is a wiring board having high density wiring, excellent connection reliability and lamination reliability. A resin woven cloth (4) is provided by arranging fiber bundles, which are composed of a single fiber (4a) or a plurality of single fibers having a linear expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin woven cloth is covered with a resin section (5) composed of a resin material having a linear expansion coefficient larger than that of silicon. |