| abstract |
Alkaline post CMP cleaning solutions are provided including at least two basic compounds that can be organic amines and/or quaternary ammonium hydroxides, at least one organic acid compound, and an inhibitor compound that inhibits corrosion of materials. The inhibitor compound is preferably a mercaptan compound. In one embodiment, a cleaning solution includes at least two organic amines but is substantially free of quaternary ammonium hydroxides. The cleaning solutions preferably have a pH ranging from about 7 to about 12. |