| abstract |
Provided herein, according to some embodiments of the invention, are organosilane polymers prepared by reacting organosilane compounds including (a) at least one compound of Formula (I) Si(OR1)(OR2)(OR3)R4 wherein R1, R2 and R3 may each independently be an alkyl group, and R4 may be -(CH2)nR5, wherein R5 may be an aryl or a substituted aryl, and n may be O or a positive integer; and (b) at least one compound of Formula (II) Si(OR6)(OR7)(OR8)R9 wherein R6, R7 and R8 may each independently an alkyl group or an aryl group; and R9 may be an alkyl group. Also provided are hardmask compositions including an organosilane compound according to an embodiment of the invention, or a hydrolysis product thereof. Methods of producing semiconductor devices using a hardmask compostion according to an embodiment of the invention, and semiconductor devices produced therefrom, are also provided. |