| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecaed0d865eafa649ccb16a714770cb7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2d2b8b95fbeb87fd3c54cda146b1471 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2007-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd6e19591fd8215e2ea81a35353ac950
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37b8e7e2fc8aca7502985ca0bb7d2ca8 |
| publicationDate |
2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007105357-A1 |
| titleOfInvention |
Epoxy resin composition for sealing of semiconductor and semiconductor device |
| abstract |
Disclosed is an epoxy resin composition for sealing of a semiconductor, wherein the composition comprises the following components (A) to (D) and contains substantially no halogen compound or antimony compound: (A) an epoxy resin which is represented by the general formula (1) and has a content of binuclear forms (i.e., components represented by the formula (1) wherein n=1) of 60 to 100% (inclusive) in terms of GPC surface area ratio and a content of a binuclear form having the bis(phenylmethyl) moiety oriented in the para-position relative to both the sites for binding to the glydicyl ether groups in the two phenylglycidyl ether moieties of35 to 100% (inclusive) in terms of NMR surface area ratio relative to the total amount of the binuclear forms; (B) a curing agent having at least two phenolic hydroxyl groups per molecule; (C) an inorganic filler; and (D) a curing-promoting agent. (1) wherein R1 and R2 independently represent an alkyl group having 1 to 4 carbon atoms; a represents an integer of 0 to 3; b represents an integer of 0 to 4; n represents an integer of 1 to 5; and G represents a glycidyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7283984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007308570-A |
| priorityDate |
2006-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |