Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e1c288b3427d299d3d471253d93232ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a193bbf98a93a588ed793bc48b9a7d3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a1b5ec569e33f6aa6afea6815115fe9d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C99-00 |
filingDate |
2007-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7d310c37bfed09a203a6a8cdd731523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fde90e117cc21ff9cc3564ea619b3de |
publicationDate |
2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2007105158-A2 |
titleOfInvention |
Method for manufacturing a microelectronic package |
abstract |
The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured using a flexible foil (80) having conductive tracks (100) on at least on side of the flexible foil. The electronic microsystem (200) and the flexible foil (80) are arranged in a way that a sealed or even hermetic package can be realized and contact pads (210) of the electronic microsystem (200) are connected to conductive tracks (100) extending to the outer surface of the packaged device after folding the flexible foil (80) in the proposed way. No vias or throughholes in the flexible foil (80) are needed. |
priorityDate |
2006-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |