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filingDate 2007-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2007086668-A1
titleOfInvention Package of light emitting diode and method for manufacturing the same
abstract Provided is a package of a light emitting diode. The package includes a metal plate, a light-emitting diode chip, an insulating layer, a lead frame, a reflective coating layer, and a molding material. The light-emitting diode chip is surface-mounted on the metal plate, and the insulating layer is formed on the metal plate and is separated from the light-emitting diode chip. The lead frame is provided on the insulating layer, the reflective coating layer is formed on the lead frame, and the molding material molds the light-emitting diode chip in a predetermined shape.
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priorityDate 2006-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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