| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7fab0af093dd9c740197a805460f9f5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a09b574d6ca827a4ef7c63abc1ce7353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6dd74b20fbf2e0ebf10c7bfad4f6c8c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e726f44d81f927d0c1cdb6540437181d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0069 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-00 |
| filingDate |
2007-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fe57e0b109e84cdf4b3c37b7dc6ff05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dbcd2e8c660c48c90ba0280c616050e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3e2ca8110a17f3663570203c4706d25 |
| publicationDate |
2007-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007083748-A1 |
| titleOfInvention |
Pressure sensor package and electronic part |
| abstract |
A pressure sensor package (10) includes a pressure sensor (11) and a first bump (18). The pressure sensor has at least a first conductive unit (17) having a space (13) inside a central region α on one surface (first surface) of a semiconductor substrate (12), a thin-plate region above the space serving as a diaphragm unit (14), and pressure sensitive elements (15) arranged in the diaphragm section. The first conductive unit (17) is arranged on an peripheral region β excluding the diaphragm unit on the first surface and electrically connected to each of the pressure sensitive elements. The first bump (18) is arranged on the first conductive unit and electrically connected to it. The thickness D1 of the semiconductor substrate at the peripheral region, the thickness D2 of the diaphragm unit, the height D3 of the space, and the remaining thickness D4 of the semiconductor substrate excluding D2 and D3 at the central region satisfy the relationships: (D2 + D3) << D4 and D1 nearly equal to D4. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102519655-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7849749-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008065883-A1 |
| priorityDate |
2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |