http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007077688-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_56fe1ffc6e4d0258e5f4a296f87cbb94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40a187af4d9b09b0f1ec1f714e2af9d4
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
filingDate 2006-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c166b92fd939f07706df6ce02fb647e
publicationDate 2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2007077688-A1
titleOfInvention Soldering method and semiconductor module manufacturing method
abstract Disclosed is a method for soldering semiconductor elements on bonding sections arranged at a plurality of areas on a circuit board, respectively. The soldering method is provided with a step of arranging the bonding sections in nonlinear arrangement on at least three areas on the circuit board; a step of arranging the semiconductor elements on the bonding sections through a solder; a step of placing a guard over the at least three semiconductor elements nonlinearly arranged; and a step of melting the solder while applying pressure to the semiconductor elements by the guard, and thus soldering the semiconductor elements on the bonding sections. As a result, at the time of soldering the semiconductor elements on the circuit board, fluctuation in solder thickness at the bonding sections is suppressed.
priorityDate 2005-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06163634-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08191130-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000332052-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0357230-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804

Total number of triples: 57.