abstract |
Disclosed is a method for soldering semiconductor elements on bonding sections arranged at a plurality of areas on a circuit board, respectively. The soldering method is provided with a step of arranging the bonding sections in nonlinear arrangement on at least three areas on the circuit board; a step of arranging the semiconductor elements on the bonding sections through a solder; a step of placing a guard over the at least three semiconductor elements nonlinearly arranged; and a step of melting the solder while applying pressure to the semiconductor elements by the guard, and thus soldering the semiconductor elements on the bonding sections. As a result, at the time of soldering the semiconductor elements on the circuit board, fluctuation in solder thickness at the bonding sections is suppressed. |