http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007059887-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fb1359691423941a4841901659b9d16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4667f0caebb836f4433ee1c1fe65aff3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N13-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02N13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2006-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6319a4a0fff54cd0ca604c4a3568c263 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a089bb2aabe7ece862254e273f9dbff |
| publicationDate | 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2007059887-A1 |
| titleOfInvention | Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement |
| abstract | The present invention relates to a bipolar carrier wafer and to a mobile bipolar electrostatic wafer arrangement. Such carrier wafers and wafer arrangements can be used, in particular, in the field of the technology for handling semiconductor wafers. The carrier wafer according to the invention is used to hold a semiconductor component which is in the form of a wafer. It has a first surface (2a) as a front side and a second surface (2b), which is opposite the first surface (2a), as a rear side. The carrier wafer is configured in such a manner that it has a carrier layer (2), an electrically insulating covering layer (3) which surrounds the carrier layer, and an electrically conductive layer (4) which is arranged on the electrically insulating covering layer and is structured in at least two regions, which are electrically isolated from one another, as electrodes. Electrical contacts are arranged on the rear side (2b) of the carrier wafer, wherein these electrical contacts are connected to the two electrodes arranged on the front side (2a). An electrically insulating covering layer (8) which covers both the front side (2a) and the edge of the carrier wafer between the front side (2a) and the rear side (2b) is also arranged on the electrically conductive layer (4). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102782827-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8503156-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7989022-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8929052-B2 |
| priorityDate | 2005-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.