| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0d33b6cd3cb23bd17eeb755793215b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87397b1c545320b1b14355cf879ce66d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f36bf436d5453dde75b3a5769b1c790
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66966793244001154113fab054c5b358 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49114 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| filingDate |
2006-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4c723d1c77989ab094f860c5b8599bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c058f0772277d0beb489e84f453a7a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a0ad4f77c9aebeacc868d769b0920b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9054218a0d318331bb578b9cff8e9936 |
| publicationDate |
2007-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007058142-A1 |
| titleOfInvention |
Method of manufacturing circuit board having electronic part |
| abstract |
A method of manufacturing a circuit board on which an electronic part is mounted comprises at least (A) a step of forming an adhesive layer on a surface of a printed board by applying a liquid photopolymerizable adhesive in which conductive particles are dispersed on the surface of the printed board, (B) a step of giving adhesiveness to the adhesive layer by applying ultraviolet rays to turn the photopolymerizable adhesive into a gel, and (C) a step of electrically connecting an electronic part and a part-mounting region of the printed board by pressing the electronic part against the top surface of the adhesive layer correspondingly to the part-mounting region. The method is characterized in that the photopolymerizable adhesive is a slow-reacting adhesive. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011071135-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013016725-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011024720-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011024720-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014039016-A |
| priorityDate |
2005-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |