| abstract |
A wafer testing and trimming arrangement for multi-leg trimming with both coarse and fine trim segments as well as an agile energy control to efficiently maintain stable pulse energy and trim rates optimized for coarse and fine trimming. The system includes a wafer probing system, a motor driven positioner system, a controller operating a test interface, image acquisition hardware configured to receive images from the probe viewing system, image processing software for determining positions of probe tips and laser spots from acquired images, and programmable illumination control of probe camera and lens illuminators. |