| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d21a4f65859c50c91ece43c75657a53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67ddb426ec27b4566aa864c9a6ed9d1c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3c382c612e29275c86d2bbdc363c3763 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G14-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2006-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90fbc9423b4e439ad70b59ac57db533e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30a947d869f7eab31989384753e9793e |
| publicationDate |
2007-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007043684-A9 |
| titleOfInvention |
Phenol polymer, production method thereof and use thereof |
| abstract |
Disclosed is a phenol polymer having flame retardance, fast curability and low melt viscosity, which is useful as a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenol polymer and use of such a phenol polymer. Specifically disclosed is a phenol polymer obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60 and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenol polymer and an epoxy resin. |
| priorityDate |
2005-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |