| abstract |
A chip-shaped electronic component is provided with a substrate and an end plane electrode layer arranged on an end plane of the substrate. The end plane electrode layer includes a mixed material. The mixed material is composed of a carbon powder, i.e., conductive particles; a whisker-like inorganic filler and a flake-like conductive powder of which surfaces are coated with conductive films; and an epoxy resin having a weight average molecular weight of 1,000-80,000. |