Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ce2ee40f3a769cdbffe8f6c608856a88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_37b7ed2015f722214718ee465b747e16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6befdb015a79354b6449912740268488 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0257 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
filingDate |
2006-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2625ee48d4aa41cdf76b469b7647e90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68be692882808f6b670bfb6321eb54de |
publicationDate |
2007-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2007029534-A1 |
titleOfInvention |
Polyamide acid containing metal ultrafine metal particle |
abstract |
Disclosed is a method for producing a polyamide acid containing ultrafine metal particles, which is characterized in that metal ions are adsorbed onto polyamide acid fine particles by bringing an aqueous solution containing a water-soluble metal compound into contact with a polyamide acid fine particles, and then a reduction process is performed. Also disclosed is a conductive adhesive containing such a polyamide acid containing ultrafine metal particles as an active ingredient. This conductive adhesive has excellent properties which enable the adhesive to be used as an alternative for a high-temperature lead solder. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105462523-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2056406-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2056406-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8142605-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013525943-A |
priorityDate |
2005-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |