| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b554d9058af14b5ea32a016c27b85e0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f80acb1e5f9480b0d2d11a31b3497da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8b0a086a79b8233f976b5db6260e4d6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| filingDate |
2006-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_396dddc1ed6e4b2616cc701cfd39938d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3ac74c991c92d53a61b4d285f1d3515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_141e8c371f2165ff862d378f626afc02 |
| publicationDate |
2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007027973-A2 |
| titleOfInvention |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
| abstract |
Methods for forming interconnects in microfeature workpieces, and microfeaturenworkpieces having such interconnects are disclosed herein. In one embodiment,na method of forming an interconnect in a microfeature workpiece includes formingna hole extending through a terminal and a dielectric layer to at least an intermediatendepth in a substrate of a workpiece. The hole has a first lateral dimension in thendielectric layer and a second lateral dimension in the substrate proximate tonan interface between the dielectric layer and the substrate. The second lateralndimension is greater than the first lateral dimension. The method further includesnconstructing an electrically conductive interconnect in at least a portionnof the hole and in electrical contact with the terminal. |
| priorityDate |
2005-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |