http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007017956-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4705d017cf555b1bc56765bc01188418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2043d18d363ca59f6778c0ae8477166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_440525c93f99c2d98746a9837271f792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_13dee5a458937040a9d2393e204888d6 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 2005-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96ce10bb1b160a93b09349c6753551d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5921665a5a219cdf1c0e45e03b0d7991 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78bfeb0ba7fea35344034aa1b56eb089 |
| publicationDate | 2007-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2007017956-A1 |
| titleOfInvention | Probe assembly |
| abstract | A probe assembly is used for electrically testing multiple semiconductor chip regions continuously so formed as to be aligned in directions perpendicular to each other on a generally circular semiconductor wafer and comprises a probe board on which multiple probes contactable with the electrical connection part of each of the semiconductor chip regions are formed. The tips of a plurality of probe groups are disposed on the probe board in X- and Y-directions perpendicular to each other corresponding to predetermined rectangular chip region groups each including a predetermined number of semiconductor chip regions. The areas where the tips of the probe groups are arranged are discontinuously formed in both the x-direction and y-direction. Relative feed movements between the probe board and semiconductor wafer either in the X- or Y-direction enable all semiconductor chip region group on the semiconductor wafer to be electrically tested. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009188009-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010181417-A |
| priorityDate | 2005-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.