| abstract |
In accordance with a first variant, an electrical component having a substrate (1) is specified, through which substrate a heat sink (109) is passed which is integrated in a filter implemented in the substrate (1). In accordance with a second variant, an electrical component having a substrate (1) is specified, through which substrate a heat sink (103, 104) is passed which is used for signal leadthrough purposes. In accordance with a third variant, an electrical component having a substrate (1) is specified, through which substrate a heat sink (105, 108) is passed which is connected to a conductive face (111, 112, 113) hidden in the substrate (1). |