http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006135079-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d747a758244f04750caa191d6bb879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12bc6f4aa272fd048a12eb9e38ce7ebc |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
filingDate | 2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bc54b084dfedc64a84ea1c6418b03cd |
publicationDate | 2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2006135079-A1 |
titleOfInvention | Electroless gold plating liquid |
abstract | Disclosed is an electroless gold plating liquid for forming a gold plating film for wire bonding which is characterized by containing a gold cyanide compound and oxalic acid and/or a salt thereof, but not containing a foundation metal dissolution inhibitor. The gold cyanide compound is preferably contained in an amount of 0.5-10 g/L in terms of gold ion concentration, and the oxalic acid and/or a salt thereof is preferably contained in an amount of 5-50 g/L. Preferably, the electroless gold plating liquid also contains a masking agent for dissolved foundation metal, and the masking agent is preferably composed of ethylenediaminetetraacetic acid and/or a salt thereof. |
priorityDate | 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.