http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006135079-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d747a758244f04750caa191d6bb879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12bc6f4aa272fd048a12eb9e38ce7ebc
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
filingDate 2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bc54b084dfedc64a84ea1c6418b03cd
publicationDate 2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2006135079-A1
titleOfInvention Electroless gold plating liquid
abstract Disclosed is an electroless gold plating liquid for forming a gold plating film for wire bonding which is characterized by containing a gold cyanide compound and oxalic acid and/or a salt thereof, but not containing a foundation metal dissolution inhibitor. The gold cyanide compound is preferably contained in an amount of 0.5-10 g/L in terms of gold ion concentration, and the oxalic acid and/or a salt thereof is preferably contained in an amount of 5-50 g/L. Preferably, the electroless gold plating liquid also contains a masking agent for dissolved foundation metal, and the masking agent is preferably composed of ethylenediaminetetraacetic acid and/or a salt thereof.
priorityDate 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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