| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7103f0e983f1a930702e61e365a7ffa8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_71fc2910ae5471b66dd833db769066a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fbffddc2b817a359bce43d7706c1c772
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e125c70aea464ce3e0bba4e51ce5ab72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fc50bd9afd8398f804906530628d080b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10G75-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10G35-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10G35-04 |
| filingDate |
2006-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb47bc2951397c78de925b3a5f744372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c705d7d6367c85c7d4c695877ce7c9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93b40ad66e9743846f409cd3676e4d2a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9e98d0d0e4e9b4001839080cc055f3 |
| publicationDate |
2006-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006130548-A2 |
| titleOfInvention |
Method of treating a surface to protect the same |
| abstract |
A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2690086-C2 |
| priorityDate |
2005-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |