| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_90568e1500b5adf5029c01428e41e8cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_19c0a399a7f0f1f88234526e44139e52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f8eb445f796ca4ad2def99e9297ef97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa47487bc2e867a7b158fe2f7e4f2720 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2006-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b00ccdc04d3d6a06fc2a3cb7ee6a2ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49105dbfb866e3607346f0fde043015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14fad6f6b161892e1077921a33974195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_620e6ea3b6c6d479cc98094256ed6e44 |
| publicationDate |
2006-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006129560-A1 |
| titleOfInvention |
Multi-layer wiring board |
| abstract |
It is possible to provide a multi-layer wiring board which can be contained in a case of an electronic device with a high density. A multi-layer wiring board (12) has a structure formed by a printed circuit board (6) having no flexibility layered via a cover lay (10) on both sides of a printed circuit board (1) having a flexibility. In the multi-layer wiring board (12), the cover lay (10) protects a portion of the printed circuit board (1) where the printed circuit board (6) is nor present and functions as an adhesive layer (11) for bonding the printed circuit board (6). That is, in the multi-layer wiring board (12), the cover layer (10) and the adhesive layer (11) are the same layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232476-B2 |
| priorityDate |
2005-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |