| abstract |
Disclosed is a metal coating film formed by applying a metal particle dispersion containing meal fine particles, water and a dispersing agent having a molecular weight of 2,000-30,000 to the surface of a base and firing it. This metal coating film is composed of an alloy containing (1) Ag and (2) at least one metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, in which alloy the Ag content is 80-99.9 at% relative to the total alloy and the average crystal grain size is 0.2-5 μm. By having such a constitution, the metal coating film has low surface roughness, excellent smoothness and excellent denseness, while exhibiting excellent adhesion to the base and excellent etching properties. Also disclosed are a method for forming such a metal coating film, and a metal wiring obtained by patterning such a metal coating film. The coating film is fired at a temperature not more than 700˚C. |