| abstract |
According to the invention, a solid encapsulate is provided comprising: (a) an oil phase; (b) a water-soluble emulsification polymer, wherein a 0.1%wt aqueous solution of the water-soluble emulsification polymer has a surface tension of 15-60 mN/m (15-60 dynes/cm) when measured at 25°C; (c) a water-soluble film-forming polymer; wherein the water-soluble emulsification polymer is different from the water-soluble film-forming polymer. |