| abstract |
A packaging substrate with flat bumps for the IC or a discrete device and a method of manufacturing the same relate to the production of the substrate for the IC or a discrete device, wherein the base islands (1) and pins (2) which all exhibit flat bump shape distribute on the front face of the substrate; the bottom side of the bumps, namely the rear faces of the base islands (1) and pins (2) are contiguous in the same substrate; the front faces of both pin and base island are disposed with another metal layer; in the packaging body of a single electronic device to be formed in later procedure, one or more base island may be included, the pin may arrange on one single side of the base island, also may arrange on the both sides or three sides of the base island, or may surround the base island so as to form the structure of one or more circuits of pins. The present invention provides the advantages which are agility, short development cycle, strong applicability, strong welding and eliminate the trouble so as to solve subsequently the problems that getting loose of pin soldering spot, delamination of the inner of packaging body and the infiltration of plastics in the packaging procedure. |