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filingDate 2006-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2006121600-B1
titleOfInvention Process and composition for conductive material removal by electrochemical mechanical polishing
abstract Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
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