| abstract |
Disclosed is a polishing composition which enables to reduce erosion or dishing in polishing of wiring metals while decreasing wiring metal residues remaining in portions other than the wiring. Specifically disclosed is a polishing composition characterized by containing an azole group-containing compound (A) containing three or more azole groups in a molecule and having a molecular weight of 300-15,000, an oxidizing agent (B) and one or more acids (C) selected from the group consisting of amino acids, organic acids and inorganic acids. |