| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_927c3131644244d81f82743c2a670aab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de3b78fd501438152f1f8bca1d1db2d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc6af2450f6ed178b3010a3795e9db26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5980d01bd7e277de4aadab44b80a128d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c308de66ce24be80b6c66c7871f44bc7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2003-248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2998-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C30-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C27-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C27-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-04 |
| filingDate |
2005-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_845de7181b460d085ce37e6e1d815d8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_102d864ecb606da7084d7b9177fa86f2 |
| publicationDate |
2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006112063-A1 |
| titleOfInvention |
Alloy material for dissipating heat from semiconductor device and method for production thereof |
| abstract |
Provided are an alloy material for heat dissipation which can be produced at a low cost, exhibits a heat expansion coefficient as low as that of a conventional composite material and a heat conductivity as great as that of pure copper, and further is excellent in machinability; and a method for producing the alloy material. In particular, since various shapes are required for an alloy material for heat dissipation, a production method using a powder sintering method, which can supply alloy materials for heat dissipation having various shapes at a low production cost is also provided in addition to a conventional melting method. A Cu-Cr alloy which comprises 0.3 to 80 mass % of Cr and a balanced amount of Cu and inevitable impurities, and has a structure wherein a particulate Cr phases having a longer diameter of 100 nm or less and an aspect ratio of less than 10 are precipitated in a density of 20 pieces/μm2 or higher in a Cu matrix except a Cr phase having a diameter of 100 nm or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106893923-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009149967-A |
| priorityDate |
2005-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |