| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69c514b76edfab583b5b499a9ff9b0b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a48de92785ece66a62381b0c06060bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e6ddf53a7a8db01a5314268a2c323b9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1da1764b179e4c15fad961cfe36af8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f4f97d87d6a32815e48b10c3488b236 |
| publicationDate |
2006-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006101769-A3 |
| titleOfInvention |
Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom |
| abstract |
A method of bonding between a first MEMS substrate (102) including at least one pattern substantially germanium layer and a secon CMOS substrate (104) including at least one patterned substantially aluminum layer through an aluminum-germanium bond (110) to create a robust electrical and mechanical contact. |
| priorityDate |
2005-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |