| abstract |
A solder bump is formed on a substrate by using a heating device where a lid structure (51) blocks hot air (41, 42) from directly blowing against a solder composition (10). Because use of the heating device reduces high-temperature oxygen molecules that come into contact with the solder composition (10), oxidation of the solder composition (10) is suppressed. As a result, in spite of the fact that the hot air (41, 42) is used for heating, a solder bump can be formed by the liquid-like solder composition (10). Further, because the lid structure (51) is uniformly heated by the hot air (41, 42), radiation heat from the lid structure (51) is also uniform, and as a result, a container (30) is more uniformly heated. In addition, because the hot air (41, 42) is suppressed from directly blowing against a liquid surface (13), the liquid-like solder composition (10) is not scattered by the hot air (41, 42). |